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SMARTsemi's KTUDCGP2AKIT1 industrial microSD Memory Card is fully SDXC UHS-I (v6.1) compliant. The device stores up to 64GB of data, video, or images in high-performance 3D-TLC NAND Flash. Type: UHS-I. Speed Classes: C10 / U3 / V30. The FLASH cards are packaged in trays. It is specifically designed to meet strict industrial operating and environmental requirements, making it equally ideal for defense, medical, networking, telecom, transportation, and industrial robotics applications as well as video game consoles, home theater devices, security cameras, drones, tablets, Smartphones, and other mobile devices.

SMARTsemi KTM4GH1AHI01 4GB eMMC 5.1 Embedded Flash Drives combine high-capacity NAND Flash memory with a high-speed Multimedia Card (MMC) controller. The eMMC is housed in a single-package. The devices are used in a wide range of consumer, networking, industrial, and automotive applications. This part number refers to Tray packaging. This component is available in both Tray (KTM4GH1AHI01) and Tape & Reel (KTM4GH1AHI01-TR) packaging.

This 4Gb DDR4 SDRAM is organized as 256 M x 16 bits and is a 2666 Mbps component packaged in a 96-ball FBGA. It is available for both industrial (KTDM4G4B626BGIEAT) and commercial (KTDM4G4B626BGCEAT) temperature grade applications. The device is widely compatible as a replacement for DDR SDRAMs used in embedded applications. This part number refers to Tray packaging.

This 4Gb DDR4 SDRAM is organized as 512 M x 8 bits and is a 2666 Mbps component packaged in a 78-ball FBGA. It is available in both commercial (KTDM4G4B826BGCEAT) and industrial (KTDM4G4B826BGIEAT) temperature grade applications. The device is widely compatible as a replacement for DDR SDRAMs used in embedded applications. This part number refers to Tray packaging.

This 4Gb DDR3(L) SDRAM is organized as 256 M x 16 bits and is a 1866Mbps component packaged in a 96-ball FBGA. It is available in three temperature ranges for various applications: Automotive (KTDM4G3C618BGAEAT) Industrial (KTDM4G3C618BGIEAT) Commercial (KTDM4G3C618BGCEAT) The device is widely compatible as a replacement for DDR3 SDRAMs used in embedded applications. The automotive temperature range device is qualified for Automotive AEC-Q100 Grade 2 applications. This part number refers to Tray packaging.

This 4Gb DDR3(L) SDRAM is organized as 512 M x 8 bits and is a 1866Mbps component packaged in a 76-ball FBGA. It is available in three temperature ranges for various applications: Automotive (KTDM4G3C818BGAEAT) Industrial (KTDM4G3C818BGIEAT) Commercial (KTDM4G3C818BGCEAT) The device is widely compatible as a replacement for DDR3 SDRAMs used in embedded applications. The automotive temperature range device is qualified for Automotive AEC-Q100 Grade 2 applications. This part number refers to Tray packaging.

This 2Gb DDR3(L) SDRAM is organized as 128 M x 16 bits and is a 1866Mbps component packaged in a 96-ball FBGA. It is available in three temperature ranges for various applications: Automotive (KTDM2G3C618BGAEAT) Industrial (KTDM2G3C618BGIEAT) Commercial (KTDM2G3C618BGCEAT) The device is widely compatible as a replacement for DDR3 SDRAMs used in embedded applications. The automotive temperature range devices are qualified for Automotive AEC-Q100 Grade 2 applications. This part number refers to Tray packaging.

This 2Gb DDR3(L) SDRAM is organized as 256 M x 8 bits and is a 1866Mbps component packaged in a 78-ball FBGA. It is available in three temperature ranges for various applications: Automotive (KTDM2G3C818BGAEAT) Industrial (KTDM2G3C818BGIEAT) Commercial (KTDM2G3C818BGCEAT) The device is widely compatible as a replacement for DDR3 SDRAMs used in embedded applications. The automotive temperature range device is qualified for Automotive AEC-Q100 Grade 2 applications. This part number refers to Tray packaging.