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The global chip shortage continues to make headlines even in its second year. Since the COVID-19 pandemic destabilized the market in 2020, the electronics industry has been plagued by supply...

This 2Gb DDR3(L) SDRAM is organized as 256 M x 8 bits and is a 1866Mbps component packaged in a 78-ball FBGA. It is available in three temperature grades for various applications: Automotive (KTDM2G3C818BGAEAT) Industrial (KTDM2G3C818BGIEAT) Commercial (KTDM2G3C818BGCEAT) The device is widely compatible as a replacement for DDR SDRAMs used in embedded applications. The automotive grade is tested and certified for Automotive AEC-Q100 Class 2 applications. This part number refers to Tray packaging.

This 2Gb DDR3(L) SDRAM is organized as 128 M x 16 bits and is a 1866Mbps component packaged in a 96-ball FBGA. It is available in three temperature grades for various applications: Automotive (KTDM2G3C618BGAEAT) Industrial (KTDM2G3C618BGIEAT) Commercial (KTDM2G3C618BGCEAT) The device is widely compatible as a replacement for DDR SDRAMs used in embedded applications. The automotive grade is tested and certified for Automotive AEC-Q100 Class 2 applications. This part number refers to Tray packaging.

This 4Gb DDR3(L) SDRAM is organized as 512 M x 8 bits and is a 1866Mbps component packaged in a 78-ball FBGA. It is available in both commercial (KTDM4G3C818BGCEAT) and industrial (KTDM4G3C818BGIEAT) temperature grade applications. The device is widely compatible as a replacement for DDR SDRAMs used in embedded applications. This part number refers to Tray packaging.

This 4Gb DDR3(L) SDRAM is organized as 256 M x 16 bits and is a 1866Mbps component packaged in a 96-ball FBGA. It is available in both commercial (KTDM4G3C618BGCEAT) and industrial (KTDM4G3C618BGIEAT) temperature grade applications. The device is widely compatible as a replacement for DDR SDRAMs used in embedded applications. This part number refers to Tray packaging.

This 4Gb DDR4 SDRAM is organized as 512 M x 8 bits and is a 2666 Mbps component packaged in a 78-ball FBGA. It is available in both commercial (KTDM4G4B826BGCEAT) and industrial (KTDM4G4B826BGIEAT) temperature grade applications. The device is widely compatible as a replacement for DDR SDRAMs used in embedded applications. This part number refers to Tray packaging.

This 4Gb DDR4 SDRAM is organized as 256 M x 16 bits and is a 2666 Mbps component packaged in a 96-ball FBGA. It is available for both industrial (KTDM4G4B626BGIEAT) and commercial (KTDM4G4B626BGCEAT) temperature grade applications. The device is widely compatible as a replacement for DDR SDRAMs used in embedded applications. This part number refers to Tray packaging.

SMARTsemi KTM4GH1AHI01 4GB eMMC 5.1 Embedded Flash Drives combine high-capacity NAND Flash memory with a high-speed Multimedia Card (MMC) controller. The eMMC is housed in a single-package. The devices are used in a wide range of consumer, networking, industrial, and automotive applications. This part number refers to Tray packaging.

This 8Gb DDR4 SDRAM is organized as 1 G x 8 bits and is a 3222 Mbps component packaged in a 78-ball FBGA. It is available for both industrial (KTDM8G4B832BGIBCT) and commercial (KTDM8G4B832BGCBCT) temperature grade applications. The device is widely compatible as a replacement for DDR SDRAMs used in embedded applications. This part number refers to Tray packaging.